ASX-listed IoT Technology company, Xped (ASX: XPE), has announced the appointment of Dr Wenjun Sheng, the chairman and CEO of Taiwanese chipmaker, Telink Semiconductor, to its board.
Telink in January announced the TLSR8269, claiming it to be “the world’s first all-in-one system-on-chip (SoC) for the Internet of Things,” that “redefines the IoT landscape by combining the features and functions needed for all 2.4GHz IoT standards into a single SoC.”
The company said that “With the ability to integrate security, voice search, touch control and other factors, the TLSR8269 is an ideal single-chip solution for human interface devices ranging from smart home applications to wireless toys.”
Telink Semiconductor was founded in 2010 and received venture capital backing from Intel Capital in 2015. According to Xped it has more than 10 chipset designs and is on target to deliver over 100,000,000 units to customers in 2016.
Xped, which recently completed a backdoor listing through Raya Group, has developed an Auto Discovery Remote Control (ADRC) technology designed to enable any devices incorporating it to be monitored and controlled from a smartphone app, via Xped’s ADRC gateway software, once the phone has been paired with the device using near field communication.
Xped is seeking to license the technology to chip manufacturers for incorporation into IoT devices but gave no indication of any such relationship with Telink. In January it announced a MoU with an un-named NASDAQ-listed chipmaker (Telink is not NASDAQ-listed) to port its firmware to the chipmaker’s library environment to make it compatible with the chipmaker’s ARM-based microcontrollers.
Sheng has over 15 years of semiconductor industry experience, and, according to XPed, “has shown an ability to grow businesses from inception, to first revenue and profitability in an effective and accelerated manner.” Prior to co‐founding Telink Semiconductor in 2010, he was VP of RFIC design at Wiscomm Microsystem, a startup company focusing on CMOS satellite TV tuner chips, and has held key technical positions with Qualcomm and Silicon Labs and was one of the pioneers in CMOS RFIC design. He holds 30 patents in RF and mixed‐signal IC design, and is a member of China’s top recruitment program of global expert, its Thousand Talents Program.
